Sikapower 1200

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  • High fatigue and impact resistance
  • Long open time at high temperature and humidity
  • Cures at room temperature
  • Accelerated curing and higher mechanical strength with heat
  • Good adhesion to fiber-reinforced plastics
  • Does not contain solvents or PVC

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SikaPower®-1200 is a tough, high strength, solvent free, thixotropic, fast curing epoxy adhesive. It is designed for fast assembly bonding of structural composite substrates, like GFRP and CFRP laminates, as well as metallic substrates. The adhesive cures by polyaddition of the two components.
Properties
Component A SikaPower®-1200 Component B SikaPower®-1040
Chemical base
Epoxy Amine
Color (CQP001-1)   mixed  
Yellow Blue
Green
Density   mixed, calculated
1.15 g/cm3 1.25 g/cm3
1.18 g/cm3
Mixing ratio A:B by volume A:B by weight 100:50 100:54
Solid content 100 %
Viscosity (CQP029-4) at 10 s-1
120 Pa·s A 45 Pa·s A
Consistency Thixotropic paste
Application temperature 15 ─ 30 °C
Open time (CQP046-11 / ISO 4587) 45 min B, C, D
Curing time (CQP046-9, ISO4587) at 23 °C at 70 °C 48 hours 2 hours
Tensile strength (CQP543-1 / ISO 527) 40 MPa C, E
E-Modulus (CQP543-1 / ISO 527) 2600 MPa C, E
Elongation at break (CQP543-1 / ISO 527) 3.5 % C, E
Tensile lap-shear strength (CQP046-9 / ISO 4587) 20 MPa C, D, E
Critical stress intensity factor KIc (ISO 13586) 2.7 m1/2 MPa C, E, F
Critical energy release rate GIc (ISO 13586) 3.5 N/mm C, E, F
Glass transition temperature (CQP509-1 / ISO 6721) 90 °C E
Shelf life drum cartridges 12 months  G 24 months  G
Solutions for wind blade and nacelle production and repair as well as erection and protection of foundations and towers, for on- and off-shore windfarms. Sealants and adhesives for photovoltaic module and thermal collector production as well as CSP mirror assemblies.

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